The product can be used as sulphate copper and wide temperature as full bright acid copper ion additives.
Due to impurities in the product of its calcium, nickel, arsenic, cobalt, iron and lead levels lower than the national control of chemical reagents sulfate GB665-88 standard, the product is mainly used in the advanced electroplating occasions such as the scientific research and IT industry.
In the manufacturing industry of electronic circuit board, the application of high purity refined copper sulphate can avoid the involvement of various kinds of metal impurities and organic impurities into the plating solution to the utmost extent. Therefore, it can effectively prevent the coating have the problems of pinhole, pitting, black coating, mildew and other failures, ensure the uniformity of the thickness and distribution of the layout and the deep plating capacity for deep holes and small holes when plating, and assist to improve ductility, tensile strength and other aspects of physical properties of coating.

Super pure copper sulfate

Item	Norm
CuSO4.5H2O，% ≥	99.5
Cu，% ≥	25.2
Fe，% ≤	0.001
Ni，% ≤	0.0005
Zn，% ≤	0.001
Pb，% ≤	0.001
PH（5%，20℃）	3.5-4.5
Co，% ≤	0.0005
Cd，% ≤	0.0003
Ca，% ≤	0.0005
As，% ≤	0.0005
chloride（Cl），% ≤	0.001
Water insoluble content，% ≤	0.005

High purity copper sulfate

Item	Norm
CuSO4.5H2O，% ≥	99
Fe，% ≤	0.002
Ni，% ≤	0.0005
Zn，% ≤	0.001
Pb，% ≤	0.001
PH（5%，20℃）	3.5-4.5
Co，% ≤	0.0005
Ca，% ≤	0.0005
As，% ≤	0.0005
chloride（Cl），% ≤	0.002
Water insoluble content，% ≤	0.005

Copper sulfate

Item	Norm
CuSO4.5H2O，% ≥	98
As，% ≤	0.0010
Pb，% ≤	0.0050
Zn，% ≤	0.0050
chloride（Cl），% ≤	0.01
Water insoluble content，% ≤	0.2
Acidity（H2SO4）	0.2
PH（5%，20℃）	3.5-4.5