CN

PRODUCTS

Micro-Grain Phosphorus Copper

The Products will go through the Microcrystalline process. The structure will be microctystal state

* Smooth surface with good plumpness
* Be able to form a firm and strong anode film
* Enlarge the cycle period of cleaning plated cylinders
* Increasing the utilization of the Copper, It can sace 3% in total.
Keywords:Micro-grain copper ball, micro-grain, high-level electroplate material, micro grain copper anode

Chemical Specification

Copper(%) Phosphor(%)
Cu P
≥99.90% 0.04%≤P≤0.065%
Impurity(%)
Ag Fe Pb Ni Zn
≤0.003% ≤0.003% ≤0.003% ≤0.003% ≤0.003%

Main model

Size (inches) Size (mm) Model
φ1 φ25 CP112
φ11/10 φ28 CP113